Features : To ensure semiconductor longevity with power applications in the order of several hundred watts per device, each element of thermal impedance must be carefully considered. CVC HEAT SINK COMPOUND is developed to reduce the high thermal impedance of air gaps otherwise present between the mating surfaces of the semiconductor case and the heat sink. This grease like compound fills the minute air gaps between the mating surfaces thereby reducing the thermal impedance. It is applied to the base and mounting studs of transistors and diodes.
The compound has good electrical insulation, it will not harden, dry out or melt even after 1000 hours at 200°C. Measurements show that the thermal resistance from mounting base to heat sink decrease by a factor of 3 when a thin film of CVC HEAT SINK COMPOUND is used.
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